J9九游会AG

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Job Title Job Type Work Place Operation
岗(gang)位职责:
1.跟踪客户,提供技(ji)术支持,解决客户在应用(yong)中遇到(dao)的问(wen)题.
2.了解客户的需要(yao),并(bing)适当地根据客户的需要(yao)进行应用(yong)设(she)计.
3.不(bu)断的进(jin)行对产(chan)品的了解及相(xiang)关技术的学习(xi).
4.了解市场的动向(xiang),及竞争对手对于产品的信息(xi).
5.配合公司内市场人员提供(gong)市场推广技术(shu)支持.

Job Description:
1.Tracking customer’s project and providing technical support, solving the issues raised by customer during the project cycle.
2.Learning the requirements from customer and providing customized developing according to the priority.
3.Keeping studying company’s new products and the relevant technology.
4.Tracking the market trends and learning the spec of competitors’ products.
5.ooperating with marketing specialist to promote company’s new products to market.

任职要求:
1.电子工程或相关专业本(ben)科及以上学(xue)历.
2.了(le)解(jie)基于ARM处理器(qi)(qi)的SOC架构(gou),熟(shu)悉高(gao)速总线,DDR,PCIe控制器(qi)(qi),GMII/SGMII,MIPI以及各种标准低速外设接口。
3.三年以(yi)上(shang)高速数字电路系统集成设计开发经(jing)验,熟练使用2种以(yi)上(shang)EDA原(yuan)理(li)图设计工具。
4.熟悉电(dian)路(lu)板性能和功耗评(ping)估(gu)以及热效(xiao)率分析。
5.具备配合BSP软件工程师定位(wei)调试问题能力
6.具备良(liang)好(hao)的问题分析能(neng)(neng)力,沟通能(neng)(neng)力和(he)团队合作(zuo)意识,车载电子行业工作(zuo)经验者优先。

Job requirements:
1.Bachelor’s degree or above on electronic engineering or similar major background.
2.Having knowledge on ARM based SOC architecture, being familiar with high-speed digital bus design, including DDR4, PCIe, GMII/SGMII, MIPI and other popular standard low-speed peripheral interfaces.
3.Over 3 years’ developing experience on high-speed digital circuit integration design, being proficient in at least 2 kinds of schematic design EDA tools.
4.Having knowledge on board level performance/power consumption/thermal analysis.
5.Having capability of trouble shooting with BSP software engineer together.
6.Excellent communication skills and teamworking spirit, experienced with vehicle electronic developing is a plus.
岗(gang)位职责:
1.跟踪(zong)客户(hu),提供技(ji)术支持,解决客户(hu)在应用中遇到的(de)问题.
2.了解客户的(de)需(xu)要,并适当地根据(ju)客户的(de)需(xu)要进(jin)行应用设计.
3.不断的进行对产品的了解及相(xiang)关技(ji)术(shu)的学(xue)习.
4.了解(jie)市场的(de)动向(xiang),及竞(jing)争对手对于(yu)产品的(de)信(xin)息.
5.配(pei)合公司内(nei)市(shi)场(chang)人(ren)员提供市(shi)场(chang)推广技术支持.

Job Description:
1.Tracking customer’s project and providing technical support, solving the issues raised by customer during the project cycle.
2.Learning the requirements from customer and providing customized developing according to the priority.
3.Keeping studying company’s new products and the relevant technology.
4.Tracking the market trends and learning the spec of competitors’ products.
5.ooperating with marketing specialist to promote company’s new products to market.

任职(zhi)要求:
1.电子工(gong)程或相关(guan)专业本(ben)科(ke)及以上学历.
2.了解(jie)基于ARM处(chu)理器的SOC架构,熟悉(xi)高速(su)(su)总线,DDR,PCIe控制器,GMII/SGMII,MIPI以及各种(zhong)标准低速(su)(su)外设(she)接口(kou)。
3.三(san)年以(yi)上(shang)高(gao)速数字电路系统集成设(she)计开发经验(yan),熟练使用(yong)2种以(yi)上(shang)EDA原理图设(she)计工具。
4.熟悉电(dian)路板性能(neng)和功耗(hao)评(ping)估以及热(re)效率分析(xi)。
5.具备配合(he)BSP软件工(gong)程师定位调试问(wen)题能力
6.具备良好的问题(ti)分析能力,沟通能力和团(tuan)队合作意识,车载电子行业工(gong)作经验者优先。

Job requirements:
1.Bachelor’s degree or above on electronic engineering or similar major background.
2.Having knowledge on ARM based SOC architecture, being familiar with high-speed digital bus design, including DDR4, PCIe, GMII/SGMII, MIPI and other popular standard low-speed peripheral interfaces.
3.Over 3 years’ developing experience on high-speed digital circuit integration design, being proficient in at least 2 kinds of schematic design EDA tools.
4.Having knowledge on board level performance/power consumption/thermal analysis.
5.Having capability of trouble shooting with BSP software engineer together.
6.Excellent communication skills and teamworking spirit, experienced with vehicle electronic developing is a plus.

岗位职责:
1.跟(gen)踪客户,提供技(ji)术支持,解决客户在应(ying)用中(zhong)遇到的(de)问题.
2.了解客(ke)户的需要,并(bing)适当地根据客(ke)户的需要进行应用设计.
3.不断的进(jin)行对产品的了(le)解及相关(guan)技术(shu)的学习.
4.了(le)解市(shi)场的动向,及竞争(zheng)对手对于(yu)产品(pin)的信息(xi).
5.配合(he)公司内市场(chang)人员提供(gong)市场(chang)推(tui)广(guang)技术支持(chi).

Job Description:
1.Tracking customer’s project and providing technical support, solving the issues raised by customer during the project cycle.
2.Learning the requirements from customer and providing customized developing according to the priority.
3.Keeping studying company’s new products and the relevant technology.
4.Tracking the market trends and learning the spec of competitors’ products.
5. Cooperating with marketing specialist to promote company’s new products to market.

任(ren)职要求(qiu):
1.计算机或相关专业本科及(ji)以上学历(li).
2.坚实(shi)的(de)C语(yu)言开(kai)发能力并能读懂(dong)数字电路原理(li)图设计逻辑。
3.了解基于ARM处(chu)理(li)器的SOC架构,熟悉高速(su)总(zong)线(xian),DDR,PCIe控制(zhi)器,GMII/SGMII,MIPI以及(ji)其它各种标准低速(su)外设(she)接口(kou)。
4.5年以上嵌(qian)入(ru)式系(xi)统(tong)软件设计开发经验(yan),至少2年以上BSP支持经验(yan)或者硬件驱(qu)动开发经验(yan)。
5.熟悉bootloader以及流程,熟悉Linux 内核,有FreeRTOS应用开发(fa)经验(yan)者优(you)先。
6.熟(shu)悉开源(yuan)社区GIT并能熟(shu)练应用相(xiang)关工具。
7.具(ju)备(bei)良好(hao)的(de)问(wen)题分析能(neng)力,沟(gou)通能(neng)力和(he)团队(dui)合作意识,车(che)载(zai)电子行业(ye)工作经验者优先。


Job requirements:
1.Bachelor’s degree or above on computer science or similar major background.
2.Solid C language knowledge and being capable to understand the digital schematic design logic.
3.Having knowledge on ARM based SOC architecture, being familiar with high-speed digital bus design, including DDR4, PCIe, GMII/SGMII, MIPI and other popular standard low-speed peripheral interfaces.
4.5+ years’ developing experience in embedded system and at least 2+ years’ experience in BSP supporting and driver developing.
5.Being familiar with bootloader, Linux kernel and being experienced with FreeRTOS is a plus.
6.Being familiar with open source community and the tools.
7.Excellent communication skills and teamworking spirit, experienced with vehicle electronic developing is a plus.

岗位职(zhi)责:
1.跟踪客(ke)户,提(ti)供技(ji)术支持(chi),解决(jue)客(ke)户在应用中(zhong)遇到(dao)的问题.
2.了(le)解客户(hu)的需要,并适当地根据客户(hu)的需要进行(xing)应(ying)用设计.
3.不断的(de)进(jin)行对产(chan)品(pin)的(de)了解及相关技术的(de)学习.
4.了解市场(chang)的动向,及竞争对(dui)手对(dui)于产(chan)品的信息.
5.配合公司内市场(chang)人员(yuan)提供市场(chang)推广(guang)技术支持.

Job Description:
1.Tracking customer’s project and providing technical support, solving the issues raised by customer during the project cycle.
2.Learning the requirements from customer and providing customized developing according to the priority.
3.Keeping studying company’s new products and the relevant technology.
4.Tracking the market trends and learning the spec of competitors’ products.
5. Cooperating with marketing specialist to promote company’s new products to market.

任职(zhi)要求:
1.计算(suan)机或相关专业(ye)本科及以上学(xue)历(li).
2.坚实的C语言(yan)开发能(neng)力并能(neng)读(du)懂(dong)数字(zi)电路(lu)原理图设计逻(luo)辑(ji)。
3.了解基于ARM处理器的SOC架构,熟悉高速总线,DDR,PCIe控制(zhi)器,GMII/SGMII,MIPI以及其它各(ge)种标准低速外设接(jie)口。
4.5年(nian)以上嵌入式系统软件设(she)计开(kai)发(fa)(fa)经(jing)验(yan),至(zhi)少2年(nian)以上BSP支持经(jing)验(yan)或者硬件驱动开(kai)发(fa)(fa)经(jing)验(yan)。
5.熟(shu)悉(xi)bootloader以及流程,熟(shu)悉(xi)Linux 内核,有FreeRTOS应用开发经验者优先(xian)。
6.熟(shu)悉开源社区GIT并能熟(shu)练(lian)应(ying)用相(xiang)关工具。
7.具(ju)备良好(hao)的问题分析能力,沟通(tong)能力和团队合(he)作(zuo)意(yi)识,车载电子行业工作(zuo)经验(yan)者优(you)先(xian)。


Job requirements:
1.Bachelor’s degree or above on computer science or similar major background.
2.Solid C language knowledge and being capable to understand the digital schematic design logic.
3.Having knowledge on ARM based SOC architecture, being familiar with high-speed digital bus design, including DDR4, PCIe, GMII/SGMII, MIPI and other popular standard low-speed peripheral interfaces.
4.5+ years’ developing experience in embedded system and at least 2+ years’ experience in BSP supporting and driver developing.
5.Being familiar with bootloader, Linux kernel and being experienced with FreeRTOS is a plus.
6.Being familiar with open source community and the tools.
7.Excellent communication skills and teamworking spirit, experienced with vehicle electronic developing is a plus.

Position Description:
The key responsibility for the position is to debug andbring up the ATE testprogram and release to mass production, including testplan definition, ATE related HW design, ATE program debugging and productionramp up.

The position requires the candidate working closely with SOCdesign/verification/validation and OSATs.

主要工作职责为开发ATE测(ce)试程序并release到封测厂进行量产, 包括(kuo)测试(shi)方案撰写,ATE相关硬件设计,ATE程(cheng)序(xu)开发(fa)和debug 量产导入等。

本职位要求ATE测试工程师能(neng)与SOC设计,验(yan)证人员以及外包供应商(OSAT以及其他相关测(ce)试服务(wu)供(gong)应商等)协(xie)同工作(zuo)进行开发。

Required Skills:
3+ years working experience as ATE Engineer
Solid knowledge of ATE Testmethodologies and ProgramDevelopment

Capability of IP level testplan development, especially analog IP andphy IP related testplan development.

Experience on major ATE platforms such as Advantest V93k, TeradyneUltra Flex, J750, etc.

Capability of ATE related HW(Loadboard/socket/probecard) design &review

Well management with outsourcing vendors

Strong problem-solving skill and good schedule keeper
Good team player

3年以(yi)上ATE 工作经(jing)历

深入理解(jie)ATE测(ce)试原理(li)及程序开发

具备独立(li)撰写testplan的能(neng)力,尤其(qi)是(shi)analog IPphy IP的(de)testplan

具有主要ATE平台的开发经历,如爱德(de)万V93k 泰(tai)瑞达 Ultra Flex, J750

具有(you)ATE相关(guan)硬件(Loadboard/socket/probecard)的设计和(he)review经验

具有良好(hao)的供应(ying)商管(guan)理(li)能力(li),团队协作能力(li),问题(ti)解决能力(li),按期(qi)交付能力(li)


Education Requirement:
- B.Sc and above degree from China top universitieswith major on EE, Micro Electronic,
Information Engineering, Telecommunication, orAutomation etc

毕业于(yu)电(dian)子(zi),微电(dian)子(zi),信息科学等相关专业

Job Description:

该职位是基于ARM处理器的基础上进行SoC的验证工作。主要目标是为解决汽车SoC提供解决方案和产品。入职人员需要从事与SoC设计/验证,平台设计等工作并和产品团队紧密合作,主要是负责SI高速信号测试验证,并具备可以保证产品研发阶段可测性需求分析评估和定位硬件测试故障分析的能力,工程师将在芯擎研发团队工作。


主要职责:

- 与EE、layout、ME合作,评估,满足(zu)产品性能的高(gao)速(su)信号叠层(ceng)、走线(xian)、互连方案(an)。

- 对高(gao)(gao)速信号(hao)(hao)电路设(she)计(ji)器件选型layout走线给(ji)出理论经验方(fang)案 ,并可(ke)以对USB23/PCIE/DP/DSI/CSI/DDR等高(gao)(gao)速信号(hao)(hao)进行(xing)SI/PI仿真(可(ke)选)。

- 芯片bench高速IO特(te)性分析与验证(zheng)。

- 制(zhi)定产(chan)品(pin)SI测试(shi)计划,保质保量(liang)完成SI测试(shi)如USB23/PCIE/DP/DSI/CSI/DDR等高低速信号测试(shi),

以及可以解决(jue)SI问题,改善(shan)电路(lu)设计(ji)。

- 主要推动协调(diao)内部(bu)SI问题解决,可以推动各(ge)部(bu)门解决SI问题,保证(zheng)项目进度。

- 实验室设备控(kong)制与(yu)测(ce)试自(zi)动化(hua)的开发

- 有SI/PI仿真(zhen)能力(li)者和硬(ying)件(jian)工程师背景更佳。

- 具备一定的脚本编写能力。

Job Requirements:

- 数学、电子、通信、信号处理、自(zi)动控制(zhi)、模式识别等相关专业本(ben)科及以上学历。 

- 熟练使用SI测试设备: 示波器,VNA网络(luo)分析仪, TDR,误码仪(BERT)等。 

- 熟练掌握(wo)USB23/PCIE/DP/DSI/CSI/DDR等(deng)高速(su)信号的一致性测试。

- 熟悉信号完整(zheng)性及传输(shu)等(deng)理论(lun)。 

- 具(ju)有配合硬件(jian)工(gong)程师(shi)查找高速信号设计出(chu)现的(de)问题(ti),并(bing)通(tong)过(guo)SI仿(fang)真提出(chu)解决(jue)方(fang)案的(de)能力。

- 具(ju)有负责高速信号眼图(tu)调参(can),优(you)化物理层性能的能力。

- 具备嵌入式软件开发经验者优先。

- 中国一流(liu)大学计算机科学、电子信息(xi)工(gong)程或自动(dong)化(hua)专(zhuan)业本科及以(yi)上(shang)学历。


Job Description:

This position needs candidate to have software development knowledge on NPU driver, framework and optimization under Android and etc. The candidate should be familiar with one of MobileNet,ShuffleNet, DeepLab solution from user’s perspective. The position requires the candidate working closely with SOC design and verification, platform design and product team to work out the solution, including bare-metal, BSP driver and application framework.

Job Requirements:

1.      B.Sc and above degree from China top universities with major on Computer Science,EE or Automation etc.

2.      3+ years of software development in automotive, embedded system or mobile.

3.      Solid knowledge on ARM architectures,especially ARMv8, Cortex R and Cortex M.

4.      Solid knowledge of machine learning,deep learning and other AI algorithms.

5.      Strong programming skill in NPU, GPU and etc.

6.      Familiar with deep learning frameworks, such as Caffe/Tensorflow.

7.      Experienced in Samsung, Qualcomm, Renesas automotive platform development is a plus.

8.      Knowledge of ISO 26262 and function safety is a plus.

9.      Independent research ability, strong sense of responsibility.

Job Description:

This position needs candidate to have software development knowledge on NPU driver, framework and optimization under Android and etc. The candidate should be familiar with one of MobileNet,ShuffleNet, DeepLab solution from user’s perspective. The position requires the candidate working closely with SOC design and verification, platform design and product team to work out the solution, including bare-metal, BSP driver and application framework.

Job Requirements:

1.      B.Sc and above degree from China top universities with major on Computer Science,EE or Automation etc.

2.      3+ years of software development in automotive, embedded system or mobile.

3.      Solid knowledge on ARM architectures,especially ARMv8, Cortex R and Cortex M.

4.      Solid knowledge of machine learning,deep learning and other AI algorithms.

5.      Strong programming skill in NPU, GPU and etc.

6.      Familiar with deep learning frameworks, such as Caffe/Tensorflow.

7.      Experienced in Samsung, Qualcomm, Renesas automotive platform development is a plus.

8.      Knowledge of ISO 26262 and function safety is a plus.

9.      Independent research ability, strong sense of responsibility.

Job Description:

负责芯擎车载平台的图像渲染等graphic开发和调试

Job Requirements:

1. 具有2年以上手机或嵌入式系统底层软件开发调试经验.

2. 熟练掌握C/C++/JAVA编程及系统调试方法.

3. 具有Linux, Android下的驱动和系统开发调试经验.

4. 具有OpenGL ES, Vulkan, OpenCL等编程和调试经验.

5. 熟悉主流GPU架构和开发,如ARM Mali GPU, IMG GPU系列等.

6. 熟悉ARM架构和编程,如ARMv8, Cortex ACortex M.

7. 有高通、三星、瑞萨、MTK等芯片的车载平台开发经验优先.

8. Screen Sharing、虚拟化开发经验者优先.

9. 良好的学习沟通能力和问题分析解决能力,有责任心.

Job Description:

建立影(ying)像(xiang)实验室。

建立ISP tuning的方案,流程,标准等规范。

车载参考开发平台上camera效果调试。

车载平台相机效果调试软件开发,维护与优化。Camera相关算法优化。

支持客户车载Camera效果调试。

Job Requirements:

2年以上相机效果调试经验,有车载相机效果调试经验者优先。

熟悉影(ying)像(xiang)实验室(shi)搭建,维护和管理。

熟练使用平台效果调试工具,可独立完成单颗sensor模组+ISP效果调试。

 熟悉ISP图像处理流程和3A算法。

熟悉Android/Linuxcamera软件架构,可分析和定位图像效果相关的问题,熟悉V4L2结构以及Android Camera架构者优先。

能对ISP算法进行优化和定制者优先。

本科及以上学历,较强的学习能(neng)力;善于沟通(tong),良好的团(tuan)队协(xie)作能(neng)力。

Job Description:

The position needs to be the lead or developer for embedded software such as driver, middleware,framework and application. The candidate should be familiar with Arm A, R or Marchitecture. The candidate should have solid C/C++ development skills and debugging skills of GDB or Trace32. The position requires the candidate working closely with BSP team to work out the solution from the bare-metal to driver and to application framework. 

Job Requirements:

1.      B.Sc and above degree from China top universities with major on Computer Science, Electronic Information Engineering, Telecommunication, EE or Automation etc

2.      5+ years of software development in automotive, embedded system or mobile.

3.      Solid knowledge/skills C/C++and Linux/Posix.

4.      Solid knowledge on ARM architectures (v8- A, R or M)

5.      Experiences in U-Boot, DTS,Linux kernel, network protocols, file system and Linux driver development.

6.      Experiences in Linux ALSA,V4L2, DRM and etc.

7.      Proven track record of success in Linux/Android Graphics/MM framework .

8.      Multi-threading programming experience (pthreads).

9.      At least one Hands-on programming experience with MM, Network, Audio.

10.   Experiences on Android HAL integration, HW accelerator driver development and integration.

11.   Proven debugging experiences on system and application with gdb and other system tools.

12.   Good to follow software development flow, version control and bug tracking with GIT, Jenkins, Bugzillaor Jira.

Job Description:

The position needs to be the lead or developer for embedded software such as driver, middleware,framework and application. The candidate should be familiar with Arm A, R or Marchitecture. The candidate should have solid C/C++ development skills and debugging skills of GDB or Trace32. The position requires the candidate working closely with BSP team to work out the solution from the bare-metal to driver and to application framework. 

Job Requirements:

1.      B.Sc and above degree from China top universities with major on Computer Science, Electronic Information Engineering, Telecommunication, EE or Automation etc

2.      5+ years of software development in automotive, embedded system or mobile.

3.      Solid knowledge/skills C/C++and Linux/Posix.

4.      Solid knowledge on ARM architectures (v8- A, R or M)

5.      Experiences in U-Boot, DTS,Linux kernel, network protocols, file system and Linux driver development.

6.      Experiences in Linux ALSA,V4L2, DRM and etc.

7.      Proven track record of success in Linux/Android Graphics/MM framework .

8.      Multi-threading programming experience (pthreads).

9.      At least one Hands-on programming experience with MM, Network, Audio.

10.   Experiences on Android HAL integration, HW accelerator driver development and integration.

11.   Proven debugging experiences on system and application with gdb and other system tools.

12.   Good to follow software development flow, version control and bug tracking with GIT, Jenkins, Bugzillaor Jira.

职位描述:

该职位负责芯擎汽车类芯片(pian)(pian)(下一代智(zhi)(zhi)能(neng)驾驶(shi)芯片(pian)(pian),智(zhi)(zhi)能(neng)座舱芯片(pian)(pian),高性能(neng)车规微(wei)处理器(qi)等)SOC架构(gou)设计。

岗位职责:

1、 根(gen)据车规(gui)(gui)芯(xin)片产品规(gui)(gui)格定义SOC芯(xin)片架构以及模(mo)块微架构设计。

2、 负(fu)责芯片架构层面(mian)的PPA优(you)化。

3、 负责分析(xi)业务特点,推动软硬(ying)件协同设

4、 负(fu)责系统性能测试和竞争性分析(xi)。

5、 负(fu)责解决芯片(pian)设计(ji)实现过程中的技(ji)术问题,确保关键规格的达成

任职要求:

1、 计算机,电(dian)子工程、微(wei)电(dian)子或相关专业(ye),硕士及以上学历

2、 熟(shu)悉基于ARM处理器的SOC架构,熟(shu)悉总线、DDR、PCIe控制器以(yi)及(ji)各种标准外设接口(kou),熟(shu)悉SOC前后端开发流程,熟(shu)悉性能和功耗评(ping)估;

3、 7年以(yi)上SOC开发经验,2年以(yi)上架构设计(ji)经验

4、 熟悉Verilog和C语言(yan),了(le)解VMM/OVM/UVM验证方法学

5、 熟悉Linux操作系统和(he)Synopsys/Cadence/Mentor各种前端(duan)设计EDA工(gong)具如Spyglass, DC, PT, VCS等(deng)。

6、 具备软硬(ying)件(jian)联合开发调试(shi)经验者优(you)先考(kao)虑

7、 有汽车类芯片SOC整合设计(ji)(ji)或架构(gou)设计(ji)(ji)

Job Description:

该职位负责芯擎汽车类芯片(下一代智能驾驶芯片,智能座舱芯片,高性能车规微处理器等)SOC架构设计。

1、 根据车规芯片产品规格定义SOC芯片架构以及模块微架构设计。

2、 负责芯片架构层面的PPA优化。

3、 负责分析业务特点,推动软硬件协同设

4、 负责系统性能测试和竞争性分析。

5、 负责解决芯片设计实现过程中的技术问题,确保关键规格的达成

Job Requirements:


计算(suan)机(ji),电子工程、微电子或(huo)相关(guan)专业,硕士及以上学历

熟悉基于ARM处理器的SOC架构,熟悉总线、DDRPCIe控制器以及各种标准外设接口,熟悉SOC前后端开发流程,熟悉性能和功耗评估;

 7年以上SOC开发经验,2年以上架构设计经验

 熟悉VerilogC语言,了解VMM/OVM/UVM验证方法学

 熟悉Linux操作系统和Synopsys/Cadence/Mentor各种前端设计EDA工具如Spyglass, DC, PT, VCS等。

具(ju)备软硬件(jian)联(lian)合开发(fa)调试经验者优先(xian)考虑

有汽车类芯片SOC整合设计或架构设计经验者优先考虑。

良好(hao)的应(ying)用能(neng)力(li)、沟通能(neng)力(li)和团队精(jing)神

Job Description:

该职位负责芯擎汽车类芯片(下一代智能驾驶芯片,智能座舱芯片,高性能车规微处理器等)SOC架构设计。

1、 根据车规芯片产品规格定义SOC芯片架构以及模块微架构设计。

2、 负责芯片架构层面的PPA优化。

3、 负责分析业务特点,推动软硬件协同设

4、 负责系统性能测试和竞争性分析。

5、 负责解决芯片设计实现过程中的技术问题,确保关键规格的达成

Job Requirements:


计(ji)算机,电子(zi)工程(cheng)、微电子(zi)或相关专(zhuan)业(ye),硕士及以上学历

熟悉基于ARM处理器的SOC架构,熟悉总线、DDRPCIe控制器以及各种标准外设接口,熟悉SOC前后端开发流程,熟悉性能和功耗评估;

 7年以上SOC开发经验,2年以上架构设计经验

 熟悉VerilogC语言,了解VMM/OVM/UVM验证方法学

 熟悉Linux操作系统和Synopsys/Cadence/Mentor各种前端设计EDA工具如Spyglass, DC, PT, VCS等。

具备软(ruan)硬件联(lian)合开发调(diao)试经验者优先考(kao)虑(lv)

有汽车类芯片SOC整合设计或架构设计经验者优先考虑。

良(liang)好的应(ying)用能力、沟通(tong)能力和团队精神(shen)

Staff Style

Elite managers in the industry closely work together in SiEngine

Staff Style Work Environment
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